• 尊龙

    BOE Website

    Back

      • BOE MLED COB

        Compared with traditional products equipped with front-loaded chips, BOE COB products with RGB full flip chip technology continue to improve the transmittance rate of the black film encapsulation program. It has more outstanding performance due to high protection and high reliability.

        • BOE MLED COB

        • BOE MLED COB

        • BOE MLED COB

      • Product Highlights

      • Cases

      • Product Parameters

      • Contact us

      Product Highlights

      • RGB full flip

        Reduce cost and improve quality

      • Thin Package

        Thinner<250um

      • Black film package

        Continue to improve picture quality

      • Common cathode drive

        Better experience closer to the screen

      • High protection and high reliability

        Reduce transport and maintenance risks

      • Power/Dual-Link solution

        Major projects are guaranteed

      • Overseas qualification

        Products are available for sale overseas

      • Curved splicing

        Enable multiple scenarios

      Product Parameters

      BYH-COB
      Specifications BYH007G BYH-B009A0 BYH-B012A0 BYH-B012A2/A3 BYH-B015A1 BYH009H BYH012H BYH015H BYH019H
      Pitch 0.78 0.9375 1.25 1.25 1.5625 0.9525 1.27 1.5875 1.905
      Module Resolution（mm） 300*337.5 300*337.5 300*337.5 150*168.75 150*168.75 304.8*342.9 304.8*342.9 304.8*342.9 304.8*342.9
      Module Size（mm） 600*337.5 600*337.5 600*337.5 600*337.5 600*337.5 609.6*342.9 609.6*342.9 609.6*342.9 609.6*342.9
      Maintenance Mode Front
      Cabinet Material Die-Cast Aluminum
      Typical Life Value（hrs） ≥100，000
      Color Gamut NTSC 110%
      Brightness（nit） ≥600 ≥1000 ≥800 ≥800 ≥800 ≥700 ≥700 ≥700 ≥700
      Refresh Rate（Hz） 3840
      Max. Power Consumption（W/m2） 470 320 310 320 230 480 480 480 480

      * Please click on the bottom of the project for more product details.

      Explore MLED

      Contact Sales